The US Department of Defense is partnering with industry and academia on a multiphase CTMA initiative to develop and validate an adhesive and sealant (A&S) material with the ability to “bond on demand” and/or “de-bond on demand” to enable greater control in the manufacture and repair of A&S joints.

Phase III objectives include the development of:

• chemical modifications needed to improve bonding and de-bonding capabilities
• properties of stimuli (thermal, electrical, photo, chemical, mechanical, etc.) that facilitate debonding
• engineering modifications for application of A&S materials to facilitate bonding performance
• engineering modifications for design and manufacture of joints to facilitate bonding performance

If you feel your organization has the technical capabilities and would like to be considered for this project, please complete the form below and upload your organization’s technical capabilities statement.

Interested Submissions Due by 11-12-24.

We encourage participation of Disadvantaged Business Enterprises (DBEs), including Minority Business Enterprises (MBEs) and Women’s Business Enterprises (WBEs).