The US Department of Defense is partnering with industry and academia on an initiative to utilize state-of-the-art onshore semiconductor manufacturing technology to demonstrate radiation hardened IP building blocks on both GF 45nm and Intel 18A technology that can be used to increase performance and lifespan in mission critical microelectronics.
Specific objectives include:
If you feel your organization has the technical capabilities and would like to be considered for this project, please complete the form below and upload your organization’s technical capabilities statement.
Interested Submissions Due by 7/17/25.
We encourage participation of Disadvantaged Business Enterprises (DBEs), including Minority Business Enterprises (MBEs) and Women’s Business Enterprises (WBEs).